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Microwave Devices - Microwave Semiconductor Devices - 3
2008 / 1 학기 서 광 석
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Microwave Diodes Diodes for Signal Processing
- Predistorter for linear amp. - Mixer/Frequency Multiplier - Switch Schottky Diode PIN Diode Heterostructure Barrier Diode Planar-Doped Barrier Diode Diodes for Signal Sources (Oscillators) Gunn Diode IMPATT Diode Resonant Tunneling Diode Varactor Diode
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Diode Nonlinear Microwave Circuits
diode frequency multiplier single-ended diode mixer
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Schottky Diode Metal (Schottky Contact) n GaAs
(Ref.) 1. Sze, “Physics of Semiconductor Devices,” Chap. 5 2. Rhoderick, “Metal-Semiconductor Contacts” n+ GaAs Metal (Ohmic Contact) Vacuum level metal n GaAs
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Schottky Diode의 Band Diagram
X <Forward bias> <Zero bias> e e e e e e <Reverse bias> Small Leakage (~nA)
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Schottky diode의 I-V 특성 thermionic theory holds when
* thermionic emission theory : 일반적(GaAs, Si) E JSM N(E) WD <Forward bias> = effective Richardson constant (A* : include quantum mechanical correction) thermionic theory holds when
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Schottky Effect ~ 수십 mV 측정 방법 I-V 특성 C-V 특성 (Photo-electron을 이용한 측정)
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Schottky Diode의 구조 GaAs의 Bn : 0.7~0.8 eV
AlxGa1-xAs 의 Bn : 0.8~0.9 eV In0.53Ga0.47As 의 Bn : 0.2 eV (better for ohmic) In0.52Al0.48As 의 Bn : ~0.5 eV (증가 시킬 필요가 있음.) * damage free process에 의한 qBn= q(m- ) 를 구현하기 위한 연구가 진행. electrochemical plating에 의한 InAlAs (/InGaAs)구조의 Pt Schottky diode (vertical) (horizontal) n n+ n+ Rch에 의한 series 저항 문제 Rch n S. I. Substrate
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Model of Schottky Diode
Rch에 의한 series 저항 문제 RON/ROFF Rseries CJ Tera-Hertz Schottky diode – diode의 width를 0.25m 정도로 감소하여 Ron + Rseries ↓, cut-off frequency ↑ (contact pad는 air-bridge로 연결)
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Microwave Schottky Diode
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Membrane-Type Schottky Diode for 1.5THz Frequency Source
Ref. : IEEE Trans. MTT, pp. 1538, 2004
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PIN Diode Switch
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Principles of Transit Time Devices
IMPATT ; INJ ~ 180º (IMPact ionization Avanche Transit Time) TUNNETT ; INJ ~ 90º (TUNNEel Transit Time) Ref. : IEEE Trans. MTT, pp. 760, 2002
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Transit-Time Millimeter-wave Sources
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Gunn Millimeter-wave Sources
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Basic Operation of Resonant Tunneling Diode (RTD)
부성(–) 저항 < RTD의 양자 우물 구조 > < RTD의 I-V 특성 > 이종 접합을 이용한 나노 양자 우물 구조 전자 터널링 현상 이용 - 초고속 동작 부성 저항 특성 - 저전력, 회로의 복잡도 감소 상온 동작 가능 ** Esaki에 의해 개발(노벨상 수상:반도체의 터널효과 연구, 1973)
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RTD Millimeter-wave Sources
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Frequency Multiplier Millimeter-wave Sources
Heterostructure Barrier Varactor (HBV) for frequency tripler & Quintupler 3W at 1.7THz with Schottky diode (2004)
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보안용 탐지 시스템 테라헤르츠(THz) 탐색시스템 밀리미터파 탐색시스템 현재의 엑스레이 검색 시스템
- 작은 양의 X-ray 사용으로 인해 많은 시간 필요 테라헤르츠(THz) 탐색시스템 주파수 흡수 계수 <폭발물> 밀리미터파 탐색시스템
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Terahertz and Infrared Solid State Sources
Quantum Cascade Laser (QCL) No compact sources exist for the generation of the LO power at 1-10THz. Ref. : M. Tonouchi, p. 97, Nature Photonics, 2007
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Power Levels for Sub-Millimeterwave Oscillators
254GHz/158μW, 346GHz/25μW Oscillator MMICs with 35nm InP HEMT (In0.75Ga0.25As channel) - NGST, 2007 p. 223, IEEE MWCL
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Sub-Millimeterwave Receiver Performance
FP : Fabry-Perot SHP : Sub-Harmonically Pumped 340GHz/16dB gain LNA MMICs with 35nm InP HEMT (In0.75Ga0.25As channel) - NGST, 2007
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Basic Principles of SIS Mixers
• SIS: superconducting tunnel junction • SIS is a “submillimeter photodiode” – One electron per photon absorbed – “photon-assisted tunneling”
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Superconducting Bolometer for Terahertz Detection
Cu/Nb metal stack Bolometer Array
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Fermi Level Pinning Fermi Level Pinning
Various Models qBn constant regardless of metal – Fermi-level pinning (Bardeen limit) Process의 영향 Metal deposition process Surface Preparation Method Thermal annealing Ref. : H. Hasegawa, IPRM 1998, p. 451
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Unified Defect Model for Schottky Barrier & Surface
- MBE에서의 금속막 증착 X-ray photoelectron spectroscopy 에 의해 qB 측정 Ec ~ 0.75eV Ev ~ 0.5eV n-type GaAs deposited metal(Å) 5 10 20 15 EC ( n-type GaAs) qBn p-type GaAs EFm EF EV EC OOOO ---- OOOO EFN Wsp ESA Wsn 1.42eV ~ 0.75eV ESD ~ 0.5eV p-GaAs EFP n-GaAs EN Surface of n-GaAs Surface of p-GaAs < Unified Defect Model for GaAs > * Model의 2개(+, -) level 존재는 이견이 없으나 level의 크기, 값에 대해서는 아직 논의/연구
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Semi-Insulating GaAs or InP Substrate
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Undoped GaAs Semi-Insulating Substrate
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