Manual for SMIS Samsung electronics Material Information Sheet Ver.1.1.

Manual for SMIS Samsung electronics Material Information Sheet Ver.1.1

SMIS Install Guide ① ①-① ①-② ①-③ ③ ④ ② When previous version exist
When first use ①-③ ③ ④ ②

SMIS Install Guide ⑥ ⑧ ⑦ ⑨
[ Automatically Java download pop up if Java is not installed ] ⑥ ⑧ ⑦ ⑨ 3

SMIS Install Guide ⑫ ⑬ Select language ⑩ Installation is complete! ⑪

Prepare the back data for SMIS
e.g.) When the Company1 make the information of IC( MMXXX123 ) Step 1 ) Clarify the composition (items) of the part Step 2 ) Divide the material as a Homogeneous Material unit Step 3 ) Calculate the used units or weight of each Homogeneous Material Sub Item Qty Material Wt(g) Substance EMC 1 Epoxy 0.13 Wire Au 0.0003 Chip Si 0.0379 Adhesive 0.16 Solder Ball Pb free solder 0.0287 PCB 0.0332 Ink 0.006 Cu 0.0032 Chip Adhesive Wire PCB EMC Solder Ball

Prepare the back data for SMIS
Step 4 ) Prepare the MSDS or Mill sheet for each Homogeneous Material Sub Item Qty Material Wt(g) Substance EMC 1 Epoxy 0.13 Antimony Trioxide( ) : 3% Wire Au 0.0003 - Chip Si 0.0379 Adhesive 0.16 Solder Ball Pb free solder 0.0287 PCB 0.0332 Bisphenol A( ) : 5% Ink 0.006 Cu 0.0032 EMC Wire Chip Adhesive PCB Solder Ball Epoxy Resin MSDS Bisphenol A 1~5% 1) Make sure the concentration of the controlled substances by Samsung. (refer to appendix ) 2) Apply the maximum concentration

SMIS Manual ■ Enter Basic information【 Company & Part information 】 ①
② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ① Enter the company name( e.g. : ABC Company, XXXX Co. etc. ) ② Enter the program user’s name( e.g. : Amy, Roy etc.) ③ Enter the program user’s position ( e.g. : Staff, Assistance, Manager etc. ) / ④ Enter the contact number ⑤ Enter the user’s or company’s / ⑥ Enter the name of the part applying( Capacitor, Resistance etc. ) ⑦ Enter the Part code ⑧ Select the applicable unit( PC 또는 m ) - PC is for Piece unit such as Chip or Resistance - m is for meter unit such as Wire ⑨ Weight is automatically calculated and filled up as other information below is entered ⑩ 본 Sheet의 SVHC Version 정보

SMIS Manual ■ Enter Part composition information ⑨ ⑧ ① ① ② ③ ④ ⑤ ⑥
Sub Item Qty Material Wt(g) Substance EMC 1 Epoxy 0.13 Antimony Trioxide( ) : 3% Wire Au 0.0003 - PCB 0.0332 Bisphenol A( ) : 5% Ink 0.006 Cu 0.0032 ⑧ ① ① ② ③ ④ ⑤ ⑥ ① First, Click the “+” for add the line for entering new part information ② Assembling part’s name/ ③ The number of the parts used / ④ Composite parts for Assembling part ⑤ The number of the Composite parts used for 1 Assembling part/ ⑥ Select Category in Combo box ⑦ Click the and select the name of the material ⑧ Select the right substance and Click “Select” ⑨ If the used substance is recycled one, Check the box for the “Recycled” and Click “Select” Note : "Recycled" means materials made by resources from the waste. Using scrap made in manufacturing process is “not recycled”

SMIS Manual ■ Enter Part composition information ④ ① ② ③
EMC Wire Chip Adhesive PCB Solder Ball Sub Item Qty Material Wt(g) Substance EMC 1 Epoxy 0.13 Antimony Trioxide( ) : 3% Wire Au 0.0003 - PCB 0.0332 Bisphenol A( ) : 5% Ink 0.006 Cu 0.0032 ④ ① ② ③ ① Select one depending the use( Basic Material or Surface Treatment ) ② Enter the weight of the Material used for 1 Sub item ※ Total part’s weight( ④ ) = Sum( Assy item Qty* Sub item Qty * Meterial weight) : Automatically calculated Therefore even if the number of used sub item is more than 2, Material weight( ② ) must be for 1 sub item ③ is automatically filled up as the substance information is entered

SMIS Manual ■ Enter Part composition information ④ ⑤ ② ③ ①
EMC Wire Chip Adhesive PCB Solder Ball Sub Item Qty Material Wt(g) Substance EMC 1 Epoxy 0.13 Antimony Trioxide( ) : 3% Wire Au 0.0003 - PCB 0.0332 Bisphenol A( ) : 5% Ink 0.006 Cu 0.0032 ⑤ 함유률 입력 時 함유량 정보는 자동 생성됨 ④ ⑤ ② ③ ① ① Drag the scroll to enter the rest of the information ② Select the Class for used substance ( See the Appendix ) ③ Select the substance’s category ④ Click to to select the substance ( See the next page ) ※ If you skip the ② and ③ stage, full list of the all substances will be shown. ※ If you proceed ② and ③ , substances of the selected category only will be shown. ⑤ Enter the concentration of the used substance ( % ) ※ Must convert ppm to % first ( e.g. : 300ppm → 0.03% )

SMIS Manual ■ Enter Part composition information
If you skip to select the Class and Category, full list of substances will be shown. ② ③ ① Choose the substance ② Look up the substance by CAS No. ③ SVHC version will be shown if the substance is SVHC ① If you select the Class and Category, substances in the selected category will be shown. SVHC version will be shown if the substance is SVHC with different color for recent change.

SMIS Manual ■ Enter Part composition information
① Click to select the exemption ② Select the exemption ③ Enter the exemption uses ( Flame retardants, Plasticizers etc. ) ① ③ ②

SMIS Manual ■ Add sub item
Qty Material Wt(g) Substance EMC 1 Epoxy 0.13 Antimony Trioxide( ) : 3% Wire Au 0.0003 - Chip Si 0.0379 Adhesive 0.16 Solder Ball Pb free solder 0.0287 PCB 0.0332 Bisphenol A( ) : 5% Ink 0.006 Cu 0.0032 ① When Assy Item is composed over 2 Sub items, Click “+” button in front of the upper Sub item to add new row and enter information. ①

SMIS Manual ■ Add row Au ① Au ① ① If you want to add sub item row, click "+“ of upper sub item row. ① ① If you want to add material row, click “+” of upper material row.

SMIS Manual ■ Delete row ① ②
① Select the box that user wants to delete ※ Note : If any item has the sub items, all sub items will be deleted as well. ② to confirm deleting process

SMIS Manual – “m” Unit ① ② ③ ① Select “m” for “meter” unit
Wire Jacket Sub Item Qty Material Wt(g) Substance Wire Jacket 1 PVC 3.5 DEHP( ) : 25% PVC( ) : 67% Wire 도체 Cu 2.2 - Wire conductor ① ② ③ ① Select “m” for “meter” unit ② “m” unit is subject to the Sub item ③ “m” unit’s Qty is always 1, the information of the substance and chemical must be entered 16

SMIS Manual ■ Check Part weight
Make sure that the weight shown here meets the measured weight of the part.( ±5% )

SMIS Manual ■ Menu ① New data ② Open the temporary saved file
③ Print the table ④ XML file integration brought by supplier ( See the next page ) ⑤ Save the file temporarily Temporary file is editable ※ Note : You should save date for backup Certain characters can’t be included ⑥ Send XML file to customer. ※XML is not editable, it’s only for data integration ※ Note : Certain characters can’t be included ⑦ Export to Excel file ⑧ Close the SMIS program ⑨ Summary submitted information ⑩ Inquiry the full list of the substances ⑪ Reset all data ① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ④ ⑨ ⑩ ⑪ ② ⑤ ⑥ ⑧

SMIS Manual ■ Data integration
XML integration XML XML Memory chip Company1 Company4 Memory Module XML Memory Module Company5 Board Unit MLCC Company2 XML PCB Company3 Memory Module 구성자재 Qty Memory Chip 36 MLCC 12 PCB 1 : ■ When Company4 buys and assembles Memory chip, MLCC and PCB Company 1, 2, 3 to make a Memory module, it should integrate each part’s XML file brought by each company

SMIS Manual ■ Notice for data integration function
It’s impossible to edit the information in XML that is integrated with SMIS file. If XML file give by supplier has wrong information, must let the supplier fix the data. - In case of subsidiary materials ( Preparation; e.g. Solder, Adhesive etc. ) used to manufacture complex articles and finished products, at first, generate XMF file from using SMIS and then integrate with other articles’ data. - When integrate data, “the content of Assy Item” is automatically changed to “the last downstream item name/the first assembled item name”

SMIS Manual ① Enter information of Company4 & Memory Module.
② Click Data Integration button( Next page ) ②

SMIS Manual ① ② ② Select the used part’s file to open the information

SMIS Manual ⑤ ⑥ ① ⑦ ② ④ ③ ① Information message will be shown when SVHC version is not recent version ② Enter the used Qty for “PC” unit ③ Enter the used amount and Qty for “m” unit e.g.) Enter the 0.5 for Used amount and 1for Qty when one 0.5 wire is used ④ To check, ⑤ To delete ⑥ To integrate the data ⑦ To see the detail information made by suppliers

SMIS Manual ① Provide summarization of substance information ①

SMIS Manual Article maker Article maker XML integration XML XML Red Wire Company1 XML Yellow Wire XML Company5 Board Unit Power Cable Black Wire XML XML Company2 Company3 Power Cable Black connector White connector Power Cable Used amount Qty Yellow Wire 0.2 m 1 Red Wire Black Wire 2 Black connector - White connector - Divide a complex article (Assy Item) to its each composed item (Sub Item) - Complete the information of Memory Module by using a “Data Integration” function with SMIS XML files of each wire and connector from Company 1 and 2 - When an item purchased per “m (meter) unit” cutted to using, enter the used amount and quantity

SMIS Manual Implement Data Integration after enter Used amount and Quantity. ③ ① ② Enter used amount on part purchased by “m” unit Enter Quantity

SMIS Manual – Subsidiary materials used to manufacture complex articles
■ The article manufacturers need to build SMIS XML data and then integrate the data for certain item when they purchase and use the material such as preparation (e.g. solder, adhesive etc.). e.g. When the manufacturer of memory module purchases solder cream to proceed SMD by itself ( SMD : Surface Mount Devices ) XML Memory chip Company1 XML Integration XML XML Memory Module MLCC Company2 Company5 Memory Module Company6 Board Unit XML Solder cream XML PCB Company3 ※ The article manufacturer (Company5) which use preparation with article builds SMIS XML file of preparation first then integrate with other article XML files MSDS Company4 Solder Cream

1) If the article that preparation will be in is countable select PC 2) If the article is countable as meter select M The last place that the preparation would be in Part code of preparation SVHC version when the data created The last place that the preparation would be in Weight Material information composing the preparation Click XML Export to complete

Import the XML data to integrate with other items

Appendix Ⅰ. Material List Ⅱ. SEC substance List Ⅲ. Exemption List

Ⅰ. Material List ■ Plastic 31 Mat.Category Mat.Name Details Plastic
ABS Acrylonitrile-Butadiene-Styrene ABS+G/F ABS Glass Fiber ABS+PMMA Acryl EPE Expanded PE EPP Expanded PP EPS Expanded PS EPU Expanded Polyurethane EVA Ethylene-Vinyl Acetate EPOXY Epoxy GPPS General Purpose PS HIPS High Impact PS MIPS Midium Impact PS HDPE High Density PE LDPE Low Density PE Nylon PA Polyamide PA+G/F PA + Glass Fiber PBT Poly butylene terephthalate PBT+ABS PBT+G/F PBT + Glass Fiber PC Poly Carbonate PC+ABS PC + ABS PC+G/F PC Glass Fiber PC+PBT PC + PBT HT-PC High Thermo PC PET Poly Ethylene Terephthalte PET blended PET+G/F PET + G/F PMMA Poly Methyl Meth Acrylate POM Polyacetal Mat.Category Mat.Name Details Plastic PP Polypropylene PP+G/F PP + G/F PPE Polyphenyleneether PPT PUR Polyurethane PVC Poly Vinyl Chloride SAN Styrene Acrylon Nitrile Tefron PE Polyethylene LCP Liquid Crystal Polymer Poron MBS Methylmethacrylate–Butadiene–Styrene PI Polyimide PCM(PC+PCT) PCT Alloy Plastic others 31

Ⅰ. Material List ■ Metal ■ Paper ■ Wood ■ Rubber ■ Glass 32
Mat.Category Mat.Name Details Metal Iron Fe Carbon steel Carbon Steel Stainless steel(STS, SUS) Stainless steel Other Steel Steel alloy Al Aluminium and Aluminium alloys Al alloys Cu Copper Cu alloys Copper alloys Mg, Mg alloys Magnesium and Magnesium alloys Ni, Ni alloys Nickel and Nickel alloys Ti,Ti alloys Titanium and Titanium alloys Ta,Ta alloys Tantalum and Tantalum alloys Zn,Zn alloys Zinc and Zinc alloys Sn + Pb solder Pb free solder Au Gold Pt Platinum Pd Palladium Ag Silver Sn Tin GA,GA alloys Galvanium and Galvanium alloys W, W alloys Tungsten and Tungsten alloys Ferrite Metal others Mat.Category Mat.Name Details Paper PB Paperboard CB Corrugated Cardboard CFB Corrugated Fiberboard Pulpmold Paper others ■ Wood Mat.Category Mat.Name Details Wood Plywood MDF Midium Density Fiber board PB Particle board Natural wood Wood others ■ Rubber Mat.Category Mat.Name Details Rubber NBR-Rubber Nitrile Butadiene Rubber CR-Rubber Chloroprene Rubber EPDM Ethylene Propylene Diene Monomer TPE Thermoplastic elastomer TPSIV Thermoplastic Elastomer Latex Rubber others ■ Glass Mat.Category Mat.Name Details Glass Tempered Glass Glass others 32

Ⅰ. Material List ■ GAS ■ Others 33 Mat.Category Mat.Name Details Gas
HCFC-22 HFC-134a R407C R410A R600a C-pentane Perfluorohexane Gas others Mat.Category Mat.Name Details Others Sponge Cement Ceramic Glass Filber Ink, Paint Adhesive Leather Magnet NaCl water Oil Silicon Textile SiO2 Carbon Black ITO Indium Tin Oxide ACF Anisotropic Conductive Film Polarizer Glue Flux Heterocyclic Heterocyclic compound Olefin Others(Chemical) Others(Organic) Others(Inorganic) 33

Ⅱ. SEC Substance List ■ Substance List 34 Classification
Substance Category Class 1 Cadmium and its compounds Lead and its compounds Mercury and its compounds Hexavalent chromium compounds Polybrominated Biphenyls Polybrominated Diphenyl Ethers Class 2 Polychlorinated bipheyls(PCB), Polychlorinated terpheyls(PCT), Polychlorinated naphtalenes(PCN) Ozone Depleting Substances Hexabromo cyclododecane Asbestos Fluorinated Green House Gas Compounds PFC, SF6 etc Formaldehyde Shortchain Chlorinated Paraffins Azocolourants and azodyes which form certain aromatic amines Nickel Tributyl tin (TBT), Triphenyl tin (TPT), Tributyl tin oxide (TBTO) Dibutyltin (DBT) compounds Dioctyltin (DOT) compounds Diarsenic Pentoxide Diarsenic Trioxide Arsenic acid and its salts Perfluoroctane Sulfonates Biocide dimethylfumarate perfluorooctanic acid and individual salts and esters of PFOA Pentachlorophenol Polycyclic Aromatic Hy Bisphenol A Nonylphenol,Nonylphenol Ethoxylate Phthalate Classification Substance Category Class 3 Brominated flame retardant Tetrabromo bisphenol A Polyvinyl Chloride Phthalate Antimony Trioxide Antimony and its compounds Beryllium and its compounds Chlorinated fire retardants Cobalt dichloride Reach REACH SVHC Candidate List REACH Authorization List REACH Restriction List Others Perchlorate Compounds Radioactive Substances Tris (2-chloroethyl)phosphate Anthracene 4,4 - Diaminodiphenylmethane Medium-chain chlorinated paraffins, C14-C17 Triclosan 2-(2H-benzotriazol-2-yl)-4,6-di-tert-butylphenol TGIC Diboron Trioxide Triphenyl phosphate 34

Ⅱ. SEC Substance List ■ Substance List – Class 1 Substance Category
Substance Name CAS No SVHC Benzyl butyl phthalate Benzyl butyl phthalate (BBP) Y Bis(2-ethylhexyl) phthalate Bis (2-ethylhexyl)phthalate (DEHP) Cadmium and its compounds Cadmium Cadmium alloys - N Cadmium carbonate Cadmium chloride Cadmium fluoride Cadmium nitrate Cadmium nitrate tetrahydrate Cadmium oxide Cadmium stearate Cadmium sulphate , Cadmium sulphide Other cadmium compounds Dibutyl phthalate Dibutyl phthalate (DBP) Diisobutyl phthalate Diisobutyl phthalate (DIBP) Hexavalent chromium compounds Acids generated from chromium trioxide and their oligomers Ammonium chromate Ammonium dichromate Barium Chromate Calcium chromate Calcium dichromate Chromic acid , Chromium trioxide Copper chromate Copper chromite Substance Category Substance Name CAS No SVHC Hexavalent chromium compounds Dichromic acid , Y Lead chromate(오렌지색 안료) N Lithium chromate Magnesium chromate Oligomers of chromic acid and dichromic acid - Other chromium compound Patassium chlorochromate Potassium chromate Potassium dichromate Sodium chromate Sodium dichromate , Strontium chromate Zinc chromate , , Zinc dichromate Lead and its compounds Acetic acid, lead salt, basic Calcium plumbate Dilead trioxide Dioxobis(stearato)trilead Fatty acids, C16-18, lead salts Lead antimonite Lead bis(tetrafluoroborate) Lead carbonate Lead chromate Lead chromate molybdate sulphate red (C.I. Pigment Red 104) This substance is identified in the Colour Index by Colour Index Constitution Number, C.I Y　 Lead cyanamidate

Substance Name CAS No SVHC Lead and its compounds Lead di(acetate) Y Lead diazide, Lead azide Lead dinitrate Lead dipicrate Lead fluosilicate N Lead hydrogen arsenate Lead hydroxcarbonate Lead molybdate Lead monoxide (lead oxide) Lead oleate Lead oxide sulfate Lead perchlorate Lead selenide Lead stearate , Lead styphnate Lead sulfate, sulphuric acid, lead salt Lead sulfochromate yellow (C.I. Pigment Yellow 34) This substance is identified in the Colour Index by Colour Index Constitution Number, C.I Lead thiocyanate Lead titanium trioxide Lead titanium zirconium oxide Lead(II) bis(methanesulfonate) Lead(Ⅱ) phosphate Lead(Ⅱ) sulfate , Lead(Ⅱ)acetate, trihydrate Lead(Ⅱ)arsenite Substance Category Substance Name CAS No SVHC Lead and its compounds Lead(Ⅱ)chloride N Lead(Ⅱ)cyanide Lead(Ⅱ)fluoride Lead(Ⅱ)iodide Lead(Ⅱ)metaborate Lead(Ⅱ)sulfide Lead(Ⅳ)acetate Lead(Ⅳ)chloride Lead(Ⅳ)oxide Lead/Tin alloy - Lead; metal Orange lead (lead tetroxide) Y Other Lead compounds Pentalead tetraoxide sulphate Pyrochlore, antimony lead yellow This substance is identified in the Colour Index by Colour Index Constitution Number, C.I Silicic acid (H2Si2O5), barium salt (1:1), lead-doped with lead (Pb) content above the applicable generic concentration limit for ’toxicity for reproduction’ Repr. 1A (CLP) or category 1 (DSD); the substance is a member of the group entry of lead compounds, with index number in Regulation (EC) No 1272/2008 Silicic acid, lead salt Sulfurous acid, lead salt, dibasic Tetraethyllead Tetralead trioxide sulphate Tetramethyl lead Trilead bis(carbonate)dihydroxide Trilead diarsenate Trilead dioxide phosphonate [Phthalato(2-)]dioxotrilead

Substance Name CAS No SVHC Mercury and its compounds Dialkylmercury - N Diphenylmercury Ethylmercury salts Mercuric chloride Mercuric sulfide Mercury Mercury alloys;amalgam Mercury(Ⅰ)chloride Mercury(Ⅰ)oxide Mercury(Ⅰ)sulfate Mercury(Ⅱ)acetate Mercury(Ⅱ)chloride Mercury(Ⅱ)fulminate Mercury(Ⅱ)nitrate Mercury(Ⅱ)oxide Methoxyethyl-mercury salts Methylmercury salts e.g Other mercury compounds Phenylmercury salts Propylmercury salts Polybrominated Biphenyls 2,2'',4,4'',5,5''-HEXABROMOBIPHENYL (PBB) 2-BROMOBIPHENYL (PBB) 3-BROMOBIPHENYL (PBB) 4-BROMOBIPHENYL (PBB) DECABROMOBIPHENYL (PBB) HEXABROMOBIPHENYL (PBB) Heptabromobiphenyl Nonabiphenyl Octabromobiphenyl Other PBBs compounds Substance Category Substance Name CAS No SVHC Polybrominated Biphenyls P,P''-DIBROMOBIPHENYL (PBB) N POLYBROMINATED BIPHENYL MIXTURE (PBB) POLYBROMINATED BIPHENYLS (PBB) Pentabrphenyl TETRABROMOBIPHENYL (PBB) Tribromobiphenyl Polybrominated Diphenyl Ethers 4-BROMODIPHENYL ETHER (PBDE) Bis(pentabromophenyl) ether (decabromodiphenyl ether) (DecaBDE) Y DIBROMODIPHENYL ETHER (PBDE) HEPTABROMODIPHENYL ETHER (PBDE) HEXABROMODIPHENYL ETHER (PBDE) NONABROMODIPHENYL ETHER (PBDE) OCTABROMODIPHENYL ETHER (PBDE) Other PBDEs compounds - PENTABROMODIPHENYL ETHER (PBDE) TETRABROMODIPHENYL ETHER (PBDE) TRIBROMODIPHENYL ETHER (PBDE)

Substance Name CAS No SVHC Arsenic acid and its salts Arsenic N Arsenic acid Y Arsenic acid disodium salt, Heptahydrate Arsenic acid, copper salt Arsenic acid, diammonium salt Arsenic acid, magnesium salt Arsenic trichloride Arsenic trihydride Arsenious acid, copper(II) salt Arsenious acid, potassium salt Calcium arsenate Diarsenic pentaoxide Diarsenic trioxide Other Arsenic acid and its salts - Triethyl arsenate Asbestos Actinolite Amosite (Grunerite) Anthophyllite Chrysotile Crocidolite Other Asbestos and its compounds Tremolite Azocolourants and azodyes which form certain aromatic amines 2,2'-dichloro-4,4'-methylenedianiline 2,4,5-trimethylaniline 2,4-diaminoanisole 2,4-xylidine Substance Category Substance Name CAS No SVHC Azocolourants and azodyes which form certain aromatic amines 2,6-xylidine N 2-Methoxyaniline; o-Anisidine Y 2-naphthylamine 3,3-dichlorobenzidine 3,3-dimethlbenzidine 3,3-dimethoxybenzidine 4,4'- Diaminodiphenylmethane (MDA) 4,4'-methylenedi-o-toluidine 4,4'-oxydianiline 4,4'-oxydianiline and its salts - 4,4-thiodianiline 4-Aminoazobenzene 4-chloro-o-toluidine 4-methyl-m-phenylenediamine (toluene-2,4-diamine) 5-nitro-o-toluidine 6-methoxy-m-toluidine (p-cresidine) Benzidine Biphenyl-4-ylamine Other Azo and its compounds o-Toluidine o-aminoazotoluene p-chloroaniline Biocide dimethylfumarate Bisphenol A

Substance Name CAS No SVHC Dibutyltin (DBT) compounds Bis (acetato) dibutyltin N Di-n-butyltin bis(methyl maleate) Di-n-butyltin di(monobutyl)maleate Dibutyl tin (DBT) Dibutyltin S,S'-bis (isooctyl mercaptoacetate) Dibutyltin bis(benzyl maleate) Dibutyltin bis(isooctylmaleate) Dibutyltin bis(octylthioglycolate) Dibutyltin diacetate Dibutyltin dibenzoate Dibutyltin dibutoxide Dibutyltin dibutyrate Dibutyltin dichloride (DBTC) Y Dibutyltin dihexanoate Dibutyltin diisostearate Dibutyltin dilaurate Dibutyltin dilauryl mercaptide Dibutyltin dimaleate Dibutyltin dioctanoate Dibutyltin dioleate Dibutyltin dipalmitate Dibutyltin disalicylate Dibutyltin distearate Dibutyltin hydrogen borate Dibutyltin isooctanoate Dibutyltin linoleate Dibutyltin linolenate Dibutyltin maleate Dibutyltin mercaptoacetate Dibutyltin mercaptopropionate Dibutyltin oxide (DBTO) Substance Category Substance Name CAS No SVHC Dibutyltin (DBT) compounds Dibutytin di(2-ethylhexyl maleate) N Diisobutyltin oxide Other Dibutyltin (DBT) compounds - 2-ethylhexyl 10-ethyl-4,4-dioctyl-7-oxo-8-oxa-3,5-dithia-4-stannatetradecanoate (DOTE) Y Dioctyl tin (DOT) Dioctyltin (DOT) compounds Dioctyltin bis(isooctyl maleate) (DOT) Dioctyltin dichloride (DOT) Dioctyltin dilaurate (DOT) Dioctyltin maleate (DOT) Dioctyltin oxide (DOT) Fluorinated Green House Gas Compounds PFC, SF6 etc Carbon tetrafluoride (Perfluoromethane) HFC-125 (C2HF5) HFC-134 (C2H2F4) HFC-134a (CH2FCF3) HFC-143 (C2H3F3) HFC-143a (C2H3F3) HFC-152a (C2H4F2) HFC-227ea (C3HF7) HFC-23 (CHF3) HFC-236cb (CH2FCF2CF3) HFC-236ea (CHF2CHFCF3) HFC-236fa (C3H2F6) HFC-245ca (C3H3F5) HFC-245fa (CHF2CH2CF3) HFC-32 (CH2F2) HFC-365mfc (CF3CH2CF2CH3) HFC-41 (CH3F) HFC-43-10mee (C5H2F10)

Substance Name CAS No SVHC Fluorinated Green House Gas Compounds PFC, SF6 etc Other GHGs - N Perfluorobutane (Decafluorobutane) Perfluorocyclobutane Perfluoroethane (Hexafluoroethane) Perfluorohexane (Tetradecafluorohexane) Perfluoropentane (Dodecafluoropentane) Perfluoropropane (Octafluoroproane) Sulfur Hexafluoride (SF6) Formaldehyde Formaldehyde, Polymer with Bromophenol and (Chloromethyl)Oxirane Formaldehyde, oligomeric reaction products with aniline Y Formaldehyde, reaction products with Butylphenol Other Formaldehydes and its compounds Hexabromo cyclododecane 1,2,5,6,9,10-hexabromocyclodecane Alpha-hexabromocyclododecane Beta-hexabromocyclododecane Gamma-hexabromocyclododecane Hexabromocyclododecane (HBCDD) and all major diastereoisomers identified: Nickel Nickel Sulfammate solution Nickel Sulfate Nickel(Ⅱ)oxide Other Nickel and its compounds Substance Category Substance Name CAS No SVHC Nonylphenol,Nonylphenol Ethoxylate Nonylphenol N Nonylphenol Ethoxylates , , , , Ozone Depleting Substances 1-bromopropane (n-propyl bromide) (C3H7Br) Y Bromochloromethane (CH2BrCl) CFC-11 (CFCl3) CFC-111 (C2FCl5) CFC-112 (C2F2Cl4) CFC-113 (C2F3Cl3) CFC-114 (C2F4Cl2) CFC-115 (C2F5Cl) CFC-12 (CF2Cl2) CFC-13 (CF3Cl) CFC-211 (C3FCl7) CFC-212 (C3F2Cl6) CFC-213 (C3F3Cl5) CFC-214 (C3F4Cl4) CFC-215 (C3F5Cl3) CFC-216 (C3F6Cl2) CFC-217 (C3F7Cl) Carbon tetrachloride (CCl4) Ethyl bromide (C2H5Br) HBFC-121B4 (C2HFBr4) HBFC-122B3 (C2HF2Br3) - HBFC-123B2 (C2HF3Br2) HBFC-124B1 (C2HF4Br) HBFC-131B3 (C2H2FBr3) HBFC-132B2 (C2H2F2Br2) HBFC-133B1 (C2H2F3Br) HBFC-141B2 (C2H3FBr2)

Substance Name CAS No SVHC Ozone Depleting Substances HBFC-142B1 (C2H3F2Br) - N HBFC-151B1 (C2H4FBr) HBFC-21B2 (CHFBr2) HBFC-221B6 (C3HFBr6) HBFC-222B5 (C3HF2Br5) HBFC-223B4 (C3HF3Br4) HBFC-224B3 (C3HF4Br3) HBFC-225B2 (C3HF5Br2) HBFC-226B1 (C3HF6Br) HBFC-22B1 (CHF2Br) HBFC-231B5 (C3H2FBr5) HBFC-232B4 (C3H2F2Br4) HBFC-233B3 (C3H2F3Br3) HBFC-234B2 (C3H2F4Br2) HBFC-235B1 (C3H2F5Br) HBFC-241B4 (C3H3FBr4) HBFC-242B3 (C3H3F2Br3) HBFC-243B2 (C3H3F3Br2) HBFC-244B1 (C3H3F4Br) HBFC-251B1 (C3H4FBr3) HBFC-252B2 (C3H4F2Br2) HBFC-253B1 (C3H4F3Br) HBFC-261B2 (C3H5FBr2) HBFC-262B1 (C3H5F2Br) HBFC-271B1 (C3H6FBr) HBFC-31B1 (CH2FBr) HCFC-121 (C2HFCl4) HCFC-122 (C2HF2Cl3) HCFC-123 (C2HF3Cl2) HCFC-124 (C2HF4Cl) HCFC-131 (C2H2FCl3) HCFC-132 (C2H2F2Cl2) HCFC-133 (C2H2F3Cl) HCFC-141 (C2H3FCl2) HCFC-141b (CH3CFCl2) HCFC-142 (C2H3F2Cl) Substance Category Substance Name CAS No SVHC Ozone Depleting Substances HCFC-142b (CH3CF2Cl) N HCFC-151 (C2H4FCl) HCFC-21 (CHFCl2) HCFC-22 (CHF2Cl) HCFC-221 (C3HFCl6) HCFC-222 (C3HF2Cl5) HCFC-223 (C3HF3Cl4) HCFC-224 (C3HF4Cl3) HCFC-225 (C3HF5Cl2) HCFC-225ca (CF3CF2CHCl2) HCFC-225cb (CF2ClCF2CHClF) HCFC-226 (C3HF6Cl) HCFC-231 (C3H2FCl5) HCFC-232 (C3H2F2Cl4) HCFC-233 (C3H2F3Cl3) HCFC-234 (C3H2F4Cl2) HCFC-235 (C3H2F5Cl) HCFC-241 (C3H3FCl4) HCFC-242 (C3H3F2Cl3) HCFC-243 (C3H3F3Cl2) HCFC-244 (C3H3F4Cl) HCFC-251 (C3H4FCl3) HCFC-252 (C3H4F2Cl2) HCFC-253 (C3H4F3Cl) HCFC-261 (C3H5FCl2) HCFC-262 (C3H5F2Cl) HCFC-271 (C3H6FCl) HCFC-31 (CH2FCl) Halon-1202 (CBr2F2) Halon-1211 (CF2BrCl) Halon-1301 (CF3Br) Halon-2402 (C2F4Br2) Methyl bromide (CH3Br) - Methyl chloride (CH3Cl) Methylchloroform (C2H3Cl3) Other Ozone depleting substances and its compounds Trifluoromethyl iodide (CF3I)

Substance Name CAS No SVHC Pentachlorophenol Other Pentachlorophenol and its salts - N Perfluoroctane Sulfonates Perfluoroctane Sulfonates (PFOS) C8F17SO2X, where X = OR, NR or other derivative Perfluorooctane sulfonic acid and its salts Perfluorooctane sulfonyl fluoride Phthalate Di-n-octyl phthalate (DNOP) Diisodecyl phthalate (DIDP) Diisononyl phthalate (DINP) , Polychlorinated bipheyls(PCB), Polychlorinated terpheyls(PCT), Polychlorinated naphtalenes(PCN) Monomethyl-dibromo-diphenyl methane (DBBT) Monomethyl-tetrachloro-diphenyl methane (Ugilec 141) Octachloronaphthalenes Other PCBs, PCTs, PCNs and its compounds Pentachloronaphthalenes Polychlorinated bipheyls(PCB) Polychlorinated naphtalenes(PCN) Polychlorinated terpheyls(PCT) Tetrachloronaphthalenes Trichloronaphthalenes Polycyclic Aromatic Hy Acenaphthen Acenaphthylen Anthracene Y Anthracene oil A complex combination of polycyclic aromatic hydrocarbons obtained from coal tar having an approximate distillation range of 300°C to 400°C (572°F to 752°F). Composed primarily of phenanthrene, anthracene and carbazole. Anthracene oil, anthracene paste Substance Category Substance Name CAS No SVHC Polycyclic Aromatic Hy Anthracene oil, anthracene paste, anthracene fraction Y Anthracene oil, anthracene paste,distn. lights Anthracene oil, anthracene-low Benzo[a]anthracen N Benzo[a]pyren Benzo[b]fluoranthen Benzo[e]pyren Benzo[ghi]perylen Benzo[j]fluoranthen Benzo[k]fluoranthen Chrysen Dibenzo[a,h]anthracen Fluoranthen Fluoren Indeno[1,2,3-cd]pyren Naphthalin Phenanthren Pyren Shortchain Chlorinated Paraffins ALKANES, C10-12, CHLORO ALKANES, C10-14, CHLORO ALKANES, C10-21, CHLORO ALKANES, C10-26, CHLORO ALKANES, C10-32, CHLORO ALKANES, C12-13, CHLORO ALKANES, C12-14, CHLORO ALKANES, C6-18, CHLORO ALKANES, CHLORO Alkanes, C10-13, chloro (Short Chain Chlorinated Paraffins) Other Alkane Carbon chain and its compounds -

Substance Name CAS No SVHC Tributyl tin (TBT), Triphenyl tin (TPT), Tributyl tin oxide (TBTO) Bis(tributyltin)oxide (TBTO) Y Coplymer of alkyl(c=8) acrylate,methyl methacrylate and tributyltin methacrylate N Methyl Methacrylate and tributyl tin methacrylate - Other Organic tin and its compounds Tributyl 2,3-dibromosuccinate Tributyl tin (TBT) Tributyl tin acetate Tributyl tin bromide Tributyl tin chloride , Tributyl tin fluoride Tributyl tin fumarate Tributyl tin laurate Tributyl tin naphthenate Tributyl tin phthalate Tributyl tin rosin salts Tributyl tin sulfamate Tributyltin cyclopentane carbonate=mixture Tributyltinmethacrylate Triphenyl tin (TPT) Triphenyl tin N, N'' -dimethyldithiocarbamate Triphenyl tin acetate(fentin acetate) Triphenyl tin chloride Triphenyl tin chloro acetate Triphenyl tin fluoride(fentin fluoride) Substance Category Substance Name CAS No SVHC Tributyl tin (TBT), Triphenyl tin (TPT), Tributyl tin oxide (TBTO) Triphenyl tin hydroxide N Triphenyltin fatty acid((9-11) salt) , , , Trivutyl tin maleate perfluorooctanic acid and individual salts and esters of PFOA Ammonium pentadecafluorooctanoate (APFO) Y Ethyl perfluorooctanoate Methyl perfluorooctanoate Other PFOAs - Pentadecafluorooctanoic acid (PFOA) Perfluorooctanoic acid potassium salt Perfluorooctanoic acid sodium salt Perfluorooctanoyl fluoride Silver perfluorooctanoate

Substance Name CAS No SVHC Antimony and its compounds Antimony N Antimony Trioxide Antimony oxide Antimony pentachloride Antimony pentoxide Antimony tetroxide Antimony trichloride Antimony trifluoride Antimony trisulfide Antimony(111) bromide Antimony(V) sulfide Indium antimony Other Antimony and its compounds - Sodium antimonate Beryllium and its compounds Beryllium carbonate Beryllium chloride Beryllium fluoride Beryllium hydroxide Beryllium metal Beryllium nitrate Beryllium oxide Beryllium phosphate Beryllium sulfate Beryllium sulphate tetrahydrate Other Beryllium and its compounds Brominated flame retardant 1,2-Bis(2,4,6-tribromo-phenoxy) ethane 1,2-Dibromo-4-(1,2 dibromo-methyl)-cyclo-hexane 1,3-Butadiene homopolymer,brominated 2,3-Dibromo-2-butene-1,4-diol ####### 2,4,6-Tribromo-phenyl-allyl-ether 2,4,6-tribromo-phenol 2,4-Dibromo-phenol Substance Category Substance Name CAS No SVHC Brominated flame retardant 2-Hydroxy-propyl-2-(2-hydroxy-ethoxy)-ethyl-TBP N Bis(2-ethylhexyl)tetrabromo-phtalate Bis(methyl)tetrabromo-phtalate Brominated epoxy resin end-capped with tribromophenol Brominated flame retardant which comes under notation of ISO code number FR(14) [Aliphatic/alicyclic brominated compounds] - Brominated flame retardant which comes under notation of ISO code number FR(15) [Aliphatic/alicyclic brominated compounds in combination with antimony compounds] Brominated flame retardant which comes under notation of ISO code number FR(16) [Aromatic brominated compounds excluding brominated diphenyl ether and biphenyls)] Brominated flame retardant which comes under notation of ISO code number FR(17) [Aromatic brominated compounds excluding brominated diphenyl ether and biphenyls) in combination with antimony compounds] Brominated flame retardant which comes under notation of ISO code number FR(22) [Aliphatic/alicyclic chlorinated and brominated compounds] Brominated flame retardant which comes under notation of ISO code number FR(42) [Brominated organic phosphorus compounds] Brominated polystyrene(BRPS) Bromo dichloromethane Bromo-/Chloro-alpha-olefin Bromo-/Chloro-paraffins

Substance Name CAS No SVHC Brominated flame retardant Chlorinated and brominated phosphate ester N Decabromo-diphenyl-ethane Dibromo-neopentyl-glycol Dibromo-propanol Dibromo-styrene grafted PP Ethylene-bis(5,6-dibromo-norbornane-2,3-dicarboximide) N,N''-Ethylene bis-(tetrabromo-phthalimide) Other BFRs, Brominated Flame Retardants and its compounds - Pentabromo-benzyl bromide Pentabromo-benzyl-acrylate, monomer Pentabromo-benzyl-acrylate, polymer Pentabromo-phenol Pentabromo-toluene Poly(2,6-dibromo-phenylene oxide) Poly-dibromo-styrene TBBS-bis-(2,3-dibromo-propyl-ether) TBPA Na salt TBPA, glycol-and propylene-oxide esters Tetra-decabromo-diphenoxy-benzene Substance Category Substance Name CAS No SVHC Brominated flame retardant Tetrabromo phthalic anhydride(TBPA) N Tetrabromo-bisphenol S Tetrabromo-chyclo-octane Tribromo-bisphenyl-maleinimide Tribromo-neopentyl-alcohol Tribromo-phenyl-allyl-ether, unspecified Tribromo-styrene Tris(2,4-Dibromo-phenyl) phosphate Tris(tribromo-neopentyl) phosphate Tris-(2,3-dibromo-propyl)-isocyanurate Vinyl bromide Chlorinated fire retardants (S)-2-CHLOROPROPIONIC ACID 1,4-BIS((1-(2,5-DICHLOROPHENYLAZO)-2-HYDROXY-3-NAPHTHOYAL)AMINO)BENZENE 1,4:7,10-DIMETHANODIBENZO(A,E)CYCLOOCTENE 1-(3,4-DICHLOROPHENYL)-3,3-DIMETHYLUREA 1-(4-CHLORO-O-SULFO-5-TOLYLAZO)-2-NAPHTHOL, BARIUM SALT ####### 1-PROPENE, HOMOPOLYMER, CHLORINATED 1H-BENZIMIDAZOLE, 2-(2-CHLOROPHENYL)- 1H-ISOINDOLE-1,3(2H)-DIONE, 4,5,6,7-TETR 2-(2 -HYDROXY-3 -TERT-BUTYL-5 -METHYLPHENYL)-5-CHLOROBENZOTRIAZOLE 2-(4-CHLOROBENZYL)-BENZIMIDAZOLE 2-BUTANONE, 3-CHLORO-

Substance Name CAS No SVHC Chlorinated fire retardants 2-BUTENAMIDE, 2-((4-CHLORO-2-NITROPHENYL)AZO)-3-HYDROXY-N-(2-METHOXYPHENYL)- N 2-BUTENAMIDE, N-(4-CHLORO-2,5-DIMETHOXYPHENYL)-2-((2,5-DIMETHOXY-4-((PHENYLAMINO)SULFONYL)PHENYL)AZO)-3-HYDROXY- 2-CHLORO-6-NITROANISOLE 2-NAPHTALENECARBOXAMIDE, 3-HYDROXY-4-((2-METHOXY-5-((PHENYLAMINO)CARBONYL)PHENYL)AZO)-N-(2-METHOXY-5-CHLOROPHENYL)- 2-NAPHTHALENECARBOXAMIDE COMPOUND 2-NAPHTHALENECARBOXAMIDE, 4-[(2,5-DICHLOROPHENYL)AZO]-3-HYDROXY-N-PHENYL- 2-NAPHTHALENECARBOXYLIC ACID, 4-((5-CHLORO-4-METHYL-2-SULFOPHENYL)AZO)-3-HYDROXY- 2-NAPHTHALENECARBOXYLIC ACID, CHLORO-AZO 2-NAPHTHANILIDE, 4 -CHLORO-3-HYDROXY-2 ,5 -DIMETHOXY-4-((2-METHOXY-5-(PHENYLCARBAMOYL)PHENYL)AZO)- 2-PYRAZOLIN-5-ONE, 4,4 -(3,3 -DICHLORO-4,4 -BIPHENYLYLENEBISAZO)- 3-(4-((2,6-DICHLORO-4-NITROPHENYL)AZO)-N-(2-HYDROXYETHYL)ANILINO)PROPIONITRILE,ACETATE (ESTER) 3-(4-CHLOROPHENYL)-1,1-DIMETHYLUREA 4(2-CHLOROETHYL)MORPHOLINE HYDROCHLORIDE 4,5-DICHLORO-2-N-OCTYL-3-ISOTHIAZOLONE 4-CHLOROTOLUENE 5-CHLORO-2-METHYL-4-ISOTHIAZOLIN-3-ONE ACETIC ACID VINYL ESTER, POLYMER WITH CHLOROETHYLENE AND VINYL ALC. ACETOACETAMIDE, 2-((4-CHLORO-2-NITROPHENYL)AZO)-N-(2-OXO-5-BENZIMIDAZOLINYL)- Substance Category Substance Name CAS No SVHC Chlorinated fire retardants ANILINE HYDROCHLORIDE N BARIUM CHLORIDE (BACL2), DIHYDRATE BASIC PIGMENT VIOLET 23 PICCS CARBAZOLE BENZAMIDE, 2,6-DICHLORO- BENZAMIDE,-CHLORO -AZO-TRIFLUOROMETHYL BENZENE, 1,2,4-TRICHLORO- BENZENE, 1,2-DICHLORO- BENZENE, 1-CHLORO-3-NITRO- BENZENE, 1-CHLORO-4-ETHENYL- BENZENESULFONIC ACID, 4-CHLORO-2-((2-HYDROXY-3-(((2- BENZOIC ACID, 2-(6-(ETHYLAMINO)-3-(ETHYLIMINO)-2,7-DIMETHYL-3H-XANTHEN-9-YL)- BUPIVACAINE HYDROCHLORIDE BUTANAMIDE, N,N -(3,3 -DIMETHYL(1,1 -BIPHENYL)-4,4 -DIYL)BIS(2-((2,4-DICHLOROPHENYL)AZO)-3-OXO- BUTENAMIDE, 2-((4-CHLORO-2-NITROPHENYL)AZO)-N-(2-CHLOROPHENYL)-3-OXO- BUTYL 2,4-DICHLOROPHENOXYACETATE C.I CROMOPHTAL RED C.I. PIGMENT GREEN 7 C.I. PIGMENT YELLOW 55 C.I. PIGMENT YELLOW 83 CARBONIC DICHLORIDE CHLORENDIC ANHYDRIDE CHLORIDE CHLORINATED NATURAL RUBBER CHLORINATED PARAFFINS CHLORINE CHLOROANILINE CHLORODIHYDROQUINOACRIDINEDIONE

Ⅱ. 관리화학물질 List ■ Substance List – Class 3 Substance Category
Substance Name CAS No SVHC Chlorinated fire retardants CHLORODIPHENYL N CHLOROENDRIC ACID CHLOROMETHYL PIVALATE (POM) CHLOROMETHYL THIAZOLONE CHLOROPENTANES, MIXTYRE OF ISOMERS CHLOROTOLURON CHROMATE(3-), BIS(5-CHLORO-3-((4,5-DIHYD CHROMATE, CHLOROPHENYL, AZO COBALT CHLORIDE (COCL2), HEXAHYDRATE COPPER MONOCHLOROPHTHALOCYANINE COPPER PERCHLOROPHTHALOCYANINE CYCLOPROPANECARBOXYLIC ACID, 3-(2-CHLORO-3,3,3-TRIFLUORO-1-PROPENYL)-2,2-DIMETHYL-, (2-METHYL(1,1 -BIPHENYL)-3-YL)METHYL ESTER, (1.ALPHA.,3.ALPHA.(Z))- DIARYLANILIDE YELLOW DICHLORO-2,2-P-CYCLOPHANE DICHLORODIMETHYLSILANE REACTION PRODUCT WITH SILICA DICHLOROMETHANE DYE 26 EPICHLOROHYDRIN ETHANAMINIUM, N-(6-(DIETHYLAMINO)-9-(2-(METHOXYCARBONYL)PHENYL)-3H-XANTHEN-3-YLIDENE)-N-ETHYL-, CHLORIDE HYDROCHLORIC ACID ISOINDOLE-TETRACHLORO-QUINOLINYL LITHIUM CHLORIDE (LICL) Lithium perchlorate METHYLAMINE HYDROCHLORIDE METHYLPHOSPHONIC DICHLORIDE NICKEL CHLORIDE (NICL2) Nickel chloride NICKEL CHLORIDE (NICL2), HEXAHYDRATE Other Chlorinated Flame Retardants - PARA-DICHLOROBENZENE PHENOL, 2,4-DICHLORO- PHOSPHONOUS DICHLORIDE, PHENYL- PHOSPHOROUS TRICHLORIDE Substance Category Substance Name CAS No SVHC Chlorinated fire retardants PHOSPHORUS OXYCHLORIDE N PHOSPHORUS PENTACHLORIDE POLYCHLOROPRENE POLYOLEFINS SULFONIC ACIDS PYRROLO(3,4-C)PYRROLE-1,4-DIONE COMPOUND SODIUM CHLORIDE TETRACHLORO-U-HYDROXY(U-METHACRYLATO-O:O)DICHROMIUM TETRACHLOROETHYLENE TETRACHLOROPHTHALIC ANHYDRIDE(TCPA) THIOSULFAN TRICHLORO DI-P-XYLYLENE TRICHLOROVINYLSILICON TRIETHYLAMINE HYDROCHLORIDE TRIS(CHLOROETHYL) PHOSPHATE Trichloroethylene Y Tris(2-chloroethyl)phosphate VINYL CHLORIDE VINYL CHLORIDE COPOLYMER VINYL CHLORIDE-VINYL ACETATE COPOLYMERS ZINC CHLORIDE Cobalt dichloride Phthalate 1,2-Benzenedicarboxylic acid diisodecyl ester (DIDP) 1,2-Benzenedicarboxylic acid, di-C6-8-branched alkyl esters, C7-rich 1,2-Benzenedicarboxylic acid, di-C7-11-branched and linear alkyl esters 1,2-Benzenedicarboxylic acid, dipentylester, branched and linear Bis(2-methoxyethyl) phthalate Diethyl phthalte(DEP) Dihexyl phthalate Diisopentylphthalate

Substance Name CAS No SVHC Phthalate Dimethyl phthalate (DMP) N Dipentyl phthalate (DPP) Y N-pentyl-isopentylphthalate Other phthalate compounds Polyvinyl Chloride Other PVC compounds - Polyvibyl Chloride(PVC) Polyvinylidene Chloride(PVC) Polyvinylimidazolinium Chloride(PVC) Tetrabromo bisphenol A 3,5,3’,5’-Tetrabromo-bisphenol A (TBBA) TBBA bis-(2-hydroxy-ethyl-ether) TBBA carbonate oligomer TBBA carbonate oligomer, 2,4,6-tribromo-phenol terminated TBBA carbonate oligomer, phenoxy end capped TBBA, 2,2-Bis(4-(2,3-Epoxypropyloxy)dibromophenyl) propane polymer TBBA, unspecified TBBA-(2,3-dibromo-propyl-ether) TBBA-TBBA-diglycidyl-ether oligomer TBBA-bis-(allyl-ether) TBBA-bisphenol A-phosgene polymer TBBA-dimethyl-ether TBBA-epichlorhydrin oligomer TBBA-polycarbonate

Ⅱ. SEC Substance List ■ Substance List – Reach Substance Category
Substance Name CAS No SVHC REACH SVHC Candidate List 1,2,3-Trichloropropane Y 1,2-Benzenedicarboxylic acid, di-C6-10-alkyl esters 1,2-Benzenedicarboxylic acid, dihexyl ester, branched and linear 1,2-Benzenedicarboxylic acid, mixed decyl and hexyl and octyl diesters 1,2-Diethoxyethane 1,2-benzenedicarboxylic acid, di-C6-10-alkyl esters; 1,2-benzenedicarboxylic acid, mixed decyl and hexyl and octyl diesters with ≥ 0.3% of dihexyl phthalate (EC No ) - 1,2-bis(2-methoxyethoxy)ethane (TEGDME; triglyme) 1,2-dichloroethane 1,2-dimethoxyethane; ethylene glycol dimethyl ether (EGDME) 1,3,5-Tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione (TGIC) 1,3,5-tris[(2S and 2R)-2,3-epoxypropyl]-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione (β-TGIC) 1,3-propanesultone 1-Methyl-2-pyrrolidone 2,4-Dinitrotoluene 2,4-di-tert-butyl-6-(5-chlorobenzotriazol-2-yl)phenol (UV-327) 2-(2H-benzotriazol-2-yl)-4,6-ditertpentylphenol (UV-328) 2-(2H-benzotriazol-2-yl)-4-(tert-butyl)-6-(sec-butyl)phenol (UV-350) 2-Ethoxyethanol 2-Ethoxyethyl acetate 2-Methoxyethanol 2-benzotriazol-2-yl-4,6-di-tert-butylphenol (UV-320) Substance Category Substance Name CAS No SVHC REACH SVHC Candidate List 4,4'-bis(dimethylamino)-4''-(methylamino)trityl alcohol with ≥ 0.1% of Michler's ketone (EC No ) or Michler's base (EC No ) Y 4,4'-bis(dimethylamino)benzophenone (Michler’s ketone) 4-(1,1,3,3-tetramethylbutyl)phenol 4-(1,1,3,3-tetramethylbutyl)phenol, ethoxylated [covering well-defined substances and UVCB substances, polymers and homologues] - 4-Nonylphenol, branched and linear [substances with a linear and/or branched alkyl chain with a carbon number of 9 covalently bound in position 4 to phenol, covering also UVCB- and well-defined substances which include any of the individual isomers or a combination thereof] 4-Nonylphenol, branched and linear, ethoxylated [substances with a linear and/or branched alkyl chain with a carbon number of 9 covalently bound in position 4 to phenol, ethoxylated covering UVCB- and well-defined substances, polymers and homologues, which include any of the individual isomers and/or combinations thereof] 5-sec-butyl-2-(2,4-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane 5-sec-butyl-2-(2,4-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane [1], 5-sec-butyl-2-(4,6-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane 5-sec-butyl-2-(4,6-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane 5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene) Acrylamide 3-ethyl-2-methyl-2-(3-methylbutyl)-1,3-oxazolidine

Substance Name CAS No SVHC REACH SVHC Candidate List Aluminosilicate Refractory Ceramic Fibres are fibres covered by index number in Annex VI, part 3, table 3.1 of Regulation (EC) No 1272/2008 of the European Parliament and of the Council of 16 December 2008 on classification, labelling and packaging of substances and mixtures, and fulfil the three following conditions: a) oxides of aluminium and silicon are the main components present (in the fibres) within variable concentration ranges b) fibres have a length weighted geometric mean diameter less two standard geometric errors of 6 or less micrometres (µm) c) alkaline oxide and alkali earth oxide (Na2O+K2O+CaO+MgO+BaO) content less or equal to 18% by weight - Y Ammonium salts of perfluorononan-1-oic-acid , Bis(2-methoxyethyl) ether Boric acid Boric acid, crude natural Cobalt(II) carbonate Cobalt(II) diacetate Cobalt(II) dinitrate Cobalt(II) sulphate Cyclohexane-1,2-dicarboxylic anhydride Cyclohexane-1,2-dicarboxylic anhydrideall possible combinations of the cis- and trans-isomers Diazene-1,2-dicarboxamide (C,C'-azodi(formamide)) (ADCA) Diboron trioxide Substance Category Substance Name CAS No SVHC REACH SVHC Candidate List Dichromium tris(chromate) Y Diethyl sulphate Dimethyl sulphate Dinoseb (6-sec-butyl-2,4-dinitrophenol) Disodium 3,3'-[[1,1'-biphenyl]-4,4'-diylbis(azo)]bis(4-aminonaphthalene-1-sulphonate) (C.I. Direct Red 28) Disodium 4-amino-3-[[4'-[(2,4-diaminophenyl)azo][1,1'-biphenyl]-4-yl]azo] -5-hydroxy-6-(phenylazo)naphthalene-2,7-disulphonate (C.I. Direct Black 38) Disodium tetraborate, anhydrous , , Formamide Furan Henicosafluoroundecanoic acid Heptacosafluorotetradecanoic acid Hexahydro-1-methylphthalic anhydride Hexahydro-3-methylphthalic anhydride Hexahydro-4-methylphthalic anhydride Hexahydromethylphthalic anhydride Hexahydromethylphthalic anhydride including cis- and trans- stereo isomeric forms and all possible combinations of the isomers - Hydrazine , Imidazolidine-2-thione (2-imidazoline-2-thiol) Methoxyacetic acid

Substance Name CAS No SVHC REACH SVHC Candidate List Methyloxirane (Propylene oxide) Y N,N,N',N'-tetramethyl-4,4'-methylenedianiline (Michler’s base) N,N-dimethylacetamide N,N-dimethylformamide N-methylacetamide Nitrobenzene Pentacosafluorotridecanoic acid Pentazinc chromate octahydroxide Perboric acid, sodium salt Perfluorononan-1-oic-acid Perfluorononan-1-oic-acid and its sodium and ammonium salts - Phenolphthalein Pitch, coal tar, high temp. Potassium hydroxyoctaoxodizincatedichromate Sodium perborate Sodium perborate; perboric acid, sodium salt Sodium peroxometaborate Sodium salts of perfluorononan-1-oic-acid , Tetraboron disodium heptaoxide, hydrate Tricosafluorododecanoic acid Trixylyl phosphate Substance Category Substance Name CAS No SVHC EACH SVHC Candidate List Zirconia Aluminosilicate Refractory Ceramic Fibres are fibres covered by index number in Annex VI, part 3, table 3.1 of Regulation (EC) No 1272/2008 of the European Parliament and of the Council - Y [4-[4,4'-bis(dimethylamino) benzhydrylidene]cyclohexa-2,5-dien-1-ylidene]dimethylammonium chloride (C.I. Basic Violet 3) with ≥ 0.1% of Michler's ketone (EC No ) or Michler's base (EC No ) [4-[[4-anilino-1-naphthyl][4-(dimethylamino)phenyl]methylene]cyclohexa-2,5-dien-1-ylidene] dimethylammonium chloride (C.I. Basic Blue 26) with ≥ 0.1% of Michler's ketone (EC No ) or Michler's base (EC No ) is-cyclohexane-1,2-dicarboxylic anhydride reaction mass of 2-ethylhexyl 10-ethyl-4,4-dioctyl-7-oxo-8-oxa-3,5-dithia-4-stannatetradecanoate and 2-ethylhexyl 10-ethyl-4-[[2-[(2-ethylhexyl)oxy]-2-oxoethyl]thio]-4-octyl-7-oxo-8-oxa-3,5-dithia-4-stannatetradecanoate (reaction mass of DOTE and MOTE) trans-cyclohexane-1,2-dicarboxylic anhydride α,α-Bis[4-(dimethylamino)phenyl]-4 (phenylamino)naphthalene-1-methanol (C.I. Solvent Blue 4) with ≥ 0.1% of Michler's ketone (EC No ) or Michler's base (EC No )

Ⅱ. SEC Substance List ■ Substance List – Others Substance Category
Substance Name CAS No SVHC Medium-chain chlorinated paraffins, C14-C17 N Perchlorate Other perchlorate compounds - Persistent Free Radicals Other PFRs, Phosphorus Flame Retardants and its compounds Triphenyl phosphate Radioactive Substances Americium-241 Cesium (Radioactive Isotopes only) (Cs ) Other radioactive substances Radon Strontium (Radioactive Isotopes only) (Sr ) Thorium-232 Uranium-238 Triclosan

Ⅲ. Exemptions List ■ Exemptions List – Class 1 Substance Category
Exception Code Exception_KR Exception_EN CD CD001 one shot pellet형태의 열차단기에 사용된 카드뮴 및 그 화합물 Cadmium and its compounds in one shot pellet type thermal cut-offs CD002 전기접점에 사용된 카드뮴 및 그 화합물 Cadmium and its compounds in electrical contacts CD003 필터용 유리 및 Reflectance standard용 유리에 함유된 납과 카드뮴 Cadmium and lead in filter glasses and glasses used for reflectance standards CD004 붕규산유리와 소다석회유리 위의 에나멜 인쇄 잉크에 함유된 납과 카드뮴 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses CD005 100dB(A)이상의 음압레벨의 고출력 Loudspeaker에 사용하는 변환기 내의 Voice coil에 직접 부착되는 전기 도체를 전기, 기계적으로 접합하기위해 사용되는 카드뮴 합금 솔더 Cadmium alloys as electrical/mechanical solder joints to electrical conductors located directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more CD007 산화베릴륨이 부착된 알루미늄 위에 사용된 thick film paste 내 카드뮴 및 산화카드뮴 Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide CD008 고체 조명 또는 디스플레이 시스템에 사용되는 색변환 II-VI LEDs(<10ug/mm2 light-emitting area) 내 카드뮴 Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm 2 of light-emitting area) for use in solid state illumination or display systems CD009 다음의 경우 glass packaging은 기준농도 초과를 예외 인정(Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits because of the addition of recycled materials Glass packaging is allowed to exceed where it complies with all the conditions established in (Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits because of the addition of recycled materials CD011 휴대용 X선 형광분석기의 카드뮴 동위원소 방사선원 Radioactive cadmium isotope source for portable X-ray fluorescence spectrometers CD012 pH 전극의 유리를 포함하는 이온선택성 전극에서 카드뮴 Sensors, detectors and electrodes : 1a. cadmium in ion selective electrodes including glass of pH electrodes CD013 적외선 광 검출기에서 카드뮴 1c. cadmium in infra-red light detectors CD014 헬륨-카드뮴레이저에서 카드뮴 Cadmium in helium-cadmium lasers. CD015 원자흡수분광램프에서 카드뮴 cadmium in atomic absorption spectroscopy lamps. CD016 자기공명영상과 초전도양자간섭계 검출기내의 초전도 재료의 금속 결합에서 카드뮴 cadmium in metallic bonds to superconducting materials in MRI and SQUID detectors. CD017 X선 측정 필터에서 카드뮴 Cadmium in X-ray measurement filters. CD018 전리방사선 검출기에서 카드뮴 Cadmium in detectors for ionising radiation. CD019 이미지에 대한 영상강화기 내의 형광코팅 내의 카드뮴-2020년 1월 1일 전 시장에 출시된 서비스 자재 Cadmium in phosphor coatings in image intensifiers for X-ray imagesX-ray until 31 December 2019 and in spare parts forX-ray systems placed on the EU marketbefore 1 January 2020 CD020 2014년 7월 22일 이전에 시장에 출시된 의료기기로 부터 재생된 재사용 서비스 자재, 2021년 7월 22일 이전에 출시된 카테고리8에 사용된 서비스 자재 내의 카드뮴은 기업내 회수 시스템으로 확인가능하다면 고객에게 공지된 후 사용될수 있다. cadmium in reused spare parts, recovered from medical devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021, provided that reuse takes place in auditable closed-loop business-to-business return systems, and that the reuse of parts is notified to the consumer CR CR001 흡수식 냉각장치의 탄소강 냉각배관내의 흡수제에 포함된 부식 방지제로서 0.75%이하 함유된 육가크롬 Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution

Exception Code Exception_KR Exception_EN CR CR002 다음의 경우 glass packaging은 기준농도 초과를 예외 인정(Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits because of the addition of recycled materials Glass packaging is allowed to exceed where it complies with all the conditions established in (Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits because of the addition of recycled materials CR003 x-ray 영상강화기 내의 광음극생성에 사용되는 알칼리 디스펜서 내의 6가 크롬은 2019년 12월 31일까지, 그에대한 서비스자재는 2020년 1월 1일 전에 출시되어야 한다. Hexavalent chromium in alkali dispensers used to create photocathodes in X-ray image intensifiers until 31 December 2019 and in spare parts for X-ray systems placed on the EU market before 1 January 2020 CR004 2014년 7월 22일 이전에 시장에 출시된 의료기기로 부터 재생된 재사용 서비스 자재, 2021년 7월 22일 이전에 출시된 카테고리8에 사용된 서비스 자재 내의 6가크롬은 기업내 회수 시스템으로 확인가능하다면 고객에게 공지된 후 사용될수 있다. hexavalent chromium in reused spare parts, recovered from medical devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021, provided that reuse takes place in auditable closed-loop business-to-business return systems, and that the reuse of parts is notified to the consumer. HG HG001 단일덮개가 씌워진 형광램프 내 다음을 초과하지 않는 수은 (버너 마다) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner): HG002 HG003 HG004 HG005 HG006 HG007 HG008 HG009 HG010 HG011 이중덮개가 씌워진 일반용 직선형광램프 내 다음을 초과하지 않는 수은(램프마다) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): HG012 HG013 HG014

Exception Code Exception_KR Exception_EN HG HG015 이중덮개가 씌워진 일반용 직선형광램프 내 다음을 초과하지 않는 수은(램프마다) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp): HG016 HG017 HG018 HG019 HG020 HG021 그 외 형광램프 내 다음을 초과하지 않는 수은 Mercury in other fluorescent lamps not exceeding (per lamp): HG022 HG023 HG024 HG025 HG026 HG027 특수용 냉음극형광램프와 외부전극형광램프(CCFL, EEFL) 내 다음을 초과하지 않는 수은 Mercury in cold cathode fluorescent lamps and external electrode fluorescent?lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): HG028 HG029 HG030 HG031

Exception Code Exception_KR Exception_EN HG HG032 특수용 냉음극형광램프와 외부전극형광램프(CCFL, EEFL) 내 다음을 초과하지 않는 수은 Mercury in cold cathode fluorescent lamps and external electrode fluorescent?lamps (CCFL and EEFL) for special purposes not exceeding (per lamp): HG033 그 외 저압방전램프 내 다음을 초과하지 않는 수은 Mercury in other low pressure discharge lamps (per lamp) HG034 HG035 일반용 연색성 Ra 60이상의 고압나트륨램프 내 다음을 초과하지 않는 수은 Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra >?60: HG036 Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra >?61: HG037 Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra >?62: HG038 Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra >?63: HG039 Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra >?64: HG040 Mercury in High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner) in lamps with improved colour rendering index Ra >?65: HG041 그 외의 일반용 연색성 고압나트륨램프 내 다음을 초과하지 않는 수은 Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner): HG042 HG043 HG044 HG045 HG046 HG047 고압수은램프 내 수은(HPMV) Mercury in High Pressure Mercury (vapour) lamps (HPMV)

Exception Code Exception_KR Exception_EN HG HG048 금속할라이트램프 내 수은(MH) Mercury in metal halide lamps (MH) HG049 그 외의 언급되지 않은?특수용 방전램프 내 수은 Mercury in other discharge lamps for special purposes not specifically mentioned HG050 디스플레이 당 30mg까지 DC 플라즈마 디스플레이 내 음극 불꽃 발생억제제(cathode sputtering inhibitor)로 사용된 수은 Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display HG051 다음의 경우 glass packaging은 기준농도 초과를 예외 인정(Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits because of the addition of recycled materials Glass packaging is allowed to exceed where it complies with all the conditions established in (Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits because of the addition of recycled materials HG052 전리방사선 검출기에서 수은 Mercury in detectors for ionising radiation. HG053 적외선 광 검출기에서 수은 1c. mercury in infra-red light detectors HG054 기준 전극에서 수은: 저염 염화 수은, 황산 수은 그리고 산화 수은 1d. Mercury in reference electrodes: low chloride mercury chloride, mercury sulphate and mercury oxide. HG055 고정밀용량과 손실측정브리지에서 수은 그리고 개폐기 또는 중계기 당 수은 20mg을 초과하지 않는 감시 및 통제기기의 고주파 RF 개폐기 및 중계기에서 수은 Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control instruments not exceeding 20 mg of mercury per switch or relay. HG056 일반용도의 30W이하, 2만시간또는 그 이상의 수명을 가진 조명기기는 3.5mg For general lighting purposes < 30 W with a lifetime equal or above h: 3,5 mg HG059 램프당 5mg이 넘지 않는 LCD 후면발광에 사용되는 냉음극 경광등에 사용되는 수은 Mercury in cold cathode fluorescent lamps for back-lighting liquid crystal displays, not exceeding 5 mg per lamp, used in industrial monitoring and control instruments placed on the market before 22 July 2017 HG060 고주파로 작동하는 혈관 초음파 영상 시스템에 사용되는 전기 회전 커넥터 내의 수은 Mercury in electric rotating connectors used in intravascular ultrasound imaging systems capable of high operating frequency (> 50 MHz) modes of operation.Expires on 30 June 2019. PB PB001 음극선관 유리 내 납 Lead in glass of cathode ray tubes PB002 0.2%무게를 초과하지 않는 형광튜브 유리 내 납 Lead in glass of fluorescent tubes not exceeding 0.2 % by weight PB003 아연 도금강 및 기계가공용 철합금 내 0.35% 이하 함유된 납 Lead as an alloying element in steel for machining purposes and in galvanized steel containing up to 0,35 % lead by weight PB004 알루미늄 합금 내 0.4% 이하 함유된 납 Lead as an alloying element in aluminium containing up to 0.4 % lead by weight

Exception Code Exception_KR Exception_EN PB PB005 구리 합금 내 4% 이하 함유된 납 Copper alloy containing up to 4 % lead by weight PB006 고융점온도 솔더 내 85% 이상 함유된 납 Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) PB007 서버, 스토리지, 스토리지 배열시스템, 스위칭을 위한 네트워크 기반장치, 시그널링, 전송, 통신을 위한 네트워크 관리장치에 사용되는 솔더에 함유된 납 Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission, and network management for telecommunications PB008 세라믹( 압전소자나 세라믹 혼합물과 같은 Capacitor 내 유전세라믹 제외) 내 납 Electrical and electronic components containing lead in ceramic other than dielectric ceramic in capacitors,?e.g. piezoelectronic devices, or ceramic matrix compound PB009 전기·전자 부품의 유리 내 납 Electrical and electronic components containing lead in a glass. PB010 전압 125V AC 이상 또는 250V DC 이상의 콘덴서 내 유전체세라믹에 함유된 납 Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher PB011 전압 125V AC 미만 또는 250V DC 미만의 콘덴서 내 유전체세라믹에 함유된 납 Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC PB012 발열, 환기, 에어컨디션, 냉각(HVACR)을 위한 압축기의 베어링 셀과 부싱에 함유된 납 Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applications PB013 C-press compliant pin connector 시스템에 사용된 납 Lead used in C-press compliant pin connector systems PB014 C-press compliant pin connector 시스템 이외에 사용된 납 Lead used in other than C-press compliant pin connector systems PB015 열전도모듈 C-ring의 코팅물질로 사용된 납 Lead as a coating material for the thermal conduction module C-ring PB016 광학적용을 위한 백색 유리 내 납 Lead in white glasses used for optical applications PB017 필터용 유리 및 Reflectance standard용 유리에 함유된 납과 카드뮴 Cadmium and lead in filter glasses and glasses used for reflectance standards PB018 마이크로프로세서의 핀과 패키지의 접합을 위해 사용되는 2개 이상의 원소으로 구성된 솔더에 80~85% 함유된 납 Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight PB019 집적회로 플립칩 패키지 내부 반도체 Die와 캐리어의 확실한 전기접속에 필요한 솔더에 함유된 납 Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages PB020 규산염으로 코팅된 튜브를 가진?직선형 백열램프 내 납 Lead in linear incandescent lamps with silicate coated tubes PB021 업무용복사기기에 사용되는 고강도방전램프 내의 발광물질로 사용되는 할로겐화납 Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications

Exception Code Exception_KR Exception_EN PB PB022 SMS((Sr,Ba)2MgSi2O7:Pb)와 같은 형광체를 사용한 포충기, 디아조복사, 리소그래피, 광화학 및 경화처리용 특수 램프로 사용되는 방전램프의 형광파우더 내에 활성제로 사용되는 납(중량비율 1%이하) Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as SMS ((Sr,Ba) 2 MgSi 2 O 7 :Pb) PB023 BSP(BaSi2O5:Pb)와 같은 형광체를 사용한 Sun tanning 램프로 사용되는 방전램프 Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi 2 O 5 :Pb) PB024 ESL(초소형 에너지 절약 램프)에 주아말감으로써 PbBiSn-Hg와 PbInSn-Hg 및 보조아말감으로써 PbSn-Hg에 특수하게 함유된 납 Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL) PB025 LCD에 사용하는 평면형광램프의 전후 기판 접합에 사용하는 유리에 함유된 납 Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for Liquid Crystal Displays (LCDs) PB026 붕규산유리와 소다석회유리 위의 에나멜 인쇄 잉크에 함유된 납과 카드뮴 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses PB027 광통신 시스템에 사용하는 RIG의 불순물로서의 납 Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems. PB028 0.65mm pitch 이하 커넥터의 마무리용으로 사용되는 납 Lead in finishes of fine pitch components?other than connectors with a pitch of 0,65 mm and less PB029 기계가공으로 구멍(Hole)이 뚫린 원반(discoidal)형 및 평면 배열(Planar array)형 세라믹 다층 콘덴서의 pin 고정용 솔더에 함유된 납 Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors PB030 표면 전도 전자 방출 디스플레이(SED) 내의 구성요소인 Seal frit, frit ring에 사용되는 산화납 Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring PB031 Black light blue램프의 유리봉합에 사용되는 산화납 Lead oxide in the glass envelope of black light blue lamps PB032 고출력(125dB SPL이상의 기본출력으로 일정시간 작동)확성기 내 변환기용 납합금 솔더 Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers PB033 상임위원회 지침 69/493/EEC 부속서 I(카테고리1,2,3,4)에 정의된 크리스탈유리 내 납 Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC ( 1 ) PB034 무수은 평판형광램프의 솔더에 함유된 납(e.g. LCD, 설계 또는 산업조명에 사용되는 램프) Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting) PB035 아르곤과 크립톤 레이저 튜브의 Window assembly 제작에 사용되는 Seal frit 내 산화납 Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes PB036 전기변압기 내 직경 100um이하의 ???얇은 구리선의 솔더링을 위한 솔더에 함유된 납 Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications PB037 Cermet-based 반고정형 가변저항기 내 납

Exception Code Exception_KR Exception_EN PB PB042 X선관(官)에서 산출되는 납 Lead bearings in X-ray tubes. PB043 전자방사선 증폭기에서 납: 마이크로 채널 판형과 모세관 판형 Lead in electromagnetic radiation amplification devices: micro-channel plate and capillary plate. PB044 X선관과 광증폭기의 유리원료에서 납 그리고 전자방사선을 전자로 변환하는 진공관과 기체레이저의 조립품을 위한 유리원료 접합제에서 납 Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert electromagnetic radiation into electrons. PB045 전리방사선의 차폐물에서 납 Lead in shielding for ionising radiation. PB046 X선 피험(被驗)물질에서 납 Lead in X-ray test objects. PB047 스테아르산 납 X선 회절 결정체 Lead stearate X-ray diffraction crystals. PB048 pH 전극의 유리를 포함하는 이온선택성 전극에서 납 Sensors, detectors and electrodes : 1a. Lead in ion selective electrodes including glass of pH electrodes PB049 전기화학식 산소 센서에서 납 양극 1b. Lead anodes in electrochemical oxygen sensors. PB050 적외선 광 검출기에서 납 1c. Lead in infra-red light detectors PB051 원자흡수분광램프에서 납 Lead in atomic absorption spectroscopy lamps. PB052 자기공명영상내의 초전도체 및 열전도체 합금에서 납 Lead in alloys as a superconductor and thermal conductor in MRI. PB053 자기공명영상과 초전도양자간섭계 검출기내의 초전도 재료의 금속 결합에서 납 Lead in metallic bonds to superconducting materials in MRI and SQUID detectors. PB054 평형추에서 납 Lead in counterweights. PB055 초음파 변환기의 단결정 압전체에서 납 Lead in single crystal piezoelectric materials for ultrasonic transducers. PB056 초음파 변환기의 접합을 위한 솔더에서 납 Lead in solders for bonding to ultrasonic transducers. PB057 휴대용 응급 제세동기의 솔더에서 납 Lead in solders in portable emergency defibrillators. PB058 8-14 μ.m 범위내에서 검출하는 위한 고성능 적외선 영상 모듈의 솔더에서 납 Lead in solders of high performance infrared imaging modules to detect in the range 8-14 μ.m. PB059 실리콘 액정표시장치에서 납 Lead in Liquid crystal on silicon (LCoS) displays. PB060 전리방사선 검출기에서 납 Lead in detectors for ionising radiation. PB061 산업용 모니터링 및 제어기기용 125V AC 또는 25V DC 이하 정격전압 콘덴서의 유전체 세라믹 납 Dielectric ceramic in capacitors for a rated voltage of less than 125V AC or 250V DC for industrial monitoring and control instruments PB069 감마빔이나 입자치료기가 시스템내에 위치한 CT나 MRI에 사용되는 정위두부프레임(stereotactic head frames)내 사용되는 아세트산 납 Lead acetate marker for use in stereotactic head frames for use with CT and MRI and in positioning systems for gamma beam and particle therapy quipment

Exception Code Exception_KR Exception_EN PB PB070 이온화 방사선에 노출된 의료기기내의 베어링과 wear surface에 대한 합금성분으로써의 납 Lead as an alloying element for bearings and wear surfaces in medical equipment exposed to ionising radiation PB080 X-ray 영상강화기 내의 알루미늄과 철사이의 진공을 가능하게 하는 타이트 커넥션에서의 납 Lead enabling vacuum tight connections between aluminium and steel in X-ray image intensifiers PB081 영하 -20도 아래에서 보통의 운전과 보관 상태를 견디며 사용되는 비자성 컨넥터(nonmagnetic connectors)를 필요로 하는 핀 컨넥터 시스템(pin connector systems)내의 납 Lead in the surface coatings of pin connector systems requiring nonmagnetic connectors which are used durably at a temperature below – 20 °C under normal operating and storage conditions PB082 인쇄회로기판 내의 납, 전기전자 부품과 인쇄회로기판의 최종 코팅 내의 납, wire 와 케이블의 연결부위의 땜납, 변환기와 센서 연결부위의 납 : 이 장치들은 영하 20도 이하에서 보통운전 및 보관조건으로 사용되어 지는 것들만 해당함 Lead in solders on printed circuit boards, termination coatings of electrical and electronic components and coatings of printed circuit boards, solders for connecting wires and cables, solders connecting transducers and sensors, that are used durably at a temperature below – 20 °C under normal operating and storage conditions. PB083 땜납 안의 납, 전기전자 부품과 인쇄회로기판 의 최종 코팅 내의 납, 전기전선 커넥션, 절연된 커넥터들에 사용되는 (a) 의료용 자기공명영상장비의 isocentre 반경 1미터 영역내의 자기영역과 이 영역내에서 사용되도록 디자인된 환자용 모니터를포함한 영역 또는 (b) 싸이클트론 자석의 외부표면으로부터 1미터내의 자기영역, 입자치료에 적용되는 빔 디렉션 컨트롤과 빔 트랜스포트에 대한자석내의 자기영역의 납 Lead in solders,termination coatings of electrical and electronic components and printed circuit boards, connections of electrical wires, shields and enclosed connectors, which are used in (a) magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical magnetic resonance imaging equipment, including patient monitors designed to be used within this sphere, or (b) magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam transport and beam direction control applied for particle therapy. PB084 디지털 어레이 디텍터의 카드뮴 텔룰라이드와 카드뮴아연 텔룰라이드를 증가시키기위한 인쇄회로기판 땜납 내의 납 Lead in solders for mounting cadmium telluride and cadmium zinc telluride digital array detectors to printed circuit boards PB085 (카테고리8)에서의 의료기기와 산업용 감시통제 장비에서 극저운등전위 결합시스템, 극저온 콜드 프로브, 극저온 콜드 헤드의 초전도체 또는 열전도체로서 사용되는 합금내의 납 Lead in alloys, as a superconductor or thermal conductor, used in cryo-cooler cold heads and/or in cryo-cooled cold probes and/or in cryo-cooled equipotential bonding systems, in medical devices (category 8) and/or in industrial monitoring and control instruments PB086 2014년 7월 22일 이전에 시장에 출시된 의료기기로 부터 재생된 재사용 서비스 자재, 2021년 7월 22일 이전에 출시된 카테고리8에 사용된 서비스 자재 내의 납은 기업내 회수 시스템으로 확인가능하다면 고객에게 공지된 후 사용될수 있다. Lead in reused spare parts, recovered from medical devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021, provided that reuse takes place in auditable closed-loop business-to-business return systems, and that the reuse of parts is notified to the consumer PB087 디텍터의 인쇄회로기판의 땜납, MRI장비 내에서 통합되어진 양전자방출 단층촬영법에 대한 데이터 획득 장치 내의 납 Lead in solders on printed circuit boards of detectors and data acquisition units for Positron Emission Tomographs which are integrated into Magnetic Resonance Imaging equipment PB088 의료기기지침(93/42/EEC)의 ClassⅡa의 이동식 의료장비와 휴대용 긴급 제세동기 내에 사용된 일반적인 인쇄회로기판 땜납 내의 납 Lead in solders on populated printed circuit boards used in Directive 93/42/EEC class IIa mobile medical devices other than portable emergency defibrillators PB089 의료기기지침(93/42/EEC)의 Class Ⅱb 이동식 의료장비와 휴대용 긴급 제세동기 내에 사용된 일반적인 인쇄회로기판 땜납 내의 납 Lead in solders on populated printed circuit boards used in Directive 93/42/EEC class IIb mobile medical devices other than portable emergency defibrillators

Exception Code Exception_KR Exception_EN PB PB090 BSP인을 함유한 체외 포토페레시스 램프가 사용되어 질때 방전램프의 형광파우더내에서 활성체로서의 납 Lead as an activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi 2 O 5 :Pb) phosphors PB091 산업용 모니터링 및 제어기기용 C-프레스 호환핀 커넥터 시스템에 사용 되는 납 Lead used in other than C-press compliant pin connector systems for industrial monitoring and control instruments. Expires on 31 December May be used after that date in spare parts for industrial monitoring and control instruments placed on the market before 1 January 2021. PB092 다음 조건 중 최소 하나 이상을 적용하는 경우전도성 측정에 사용하는 백금화 백금 전극의 납, a) 농도를 알 수 없는 경우 실험실 용도로102을 포괄하는 전도성 범위(예, 0.1mS/m과 5 mS/m 사이 범위)를 가진광범위한 측정, (b) 다음 중 하나에 대해 +/-1% 정확도의샘플범위와 전극의 높은 부식성 저항이필요한 경우의 용액 측정, (i) 산성도가 pH 1 미만인 용액, (ii ) 알칼리도가 pH 13을 초과하는 용액, (ii i) 할로겐 가스를 포함하는 부식성 용액, (c) 휴대용 계측기로 수행하는 100 mS/m이상 전도성에 대한 측정 Lead in platinized platinum electrodes used for conductivity measurements where at least one of the following conditions applies:(a) wide-range measurements with a conductivity range covering more than 1 order of magnitude (e.g. range between 0,1 mS/m and 5 mS/m) in laboratory applications for unknown concentrations;(b) measurements of solutions where an accuracy of +/– 1 % of the sample range and where high corrosion resistance of the electrode are required for any of the following: (i) solutions with an acidity < pH 1; (ii) solutions with an alkalinity > pH 13; (iii) corrosive solutions containing halogen gas;(c) measurements of conductivities above 100 mS/m that must be performed with portable instruments. PB093 X선 시스템과 컴퓨터 단층 촬영의 X선 감지기에서사용하는 인터페이스당 상호 연결이 500을초과하는 다이 성분이 쌓여서 포개진 넓은지역의 인터페이스에서 납땜용 납 Lead in solder in one interface of large area stacked die elements with more than 500 interconnects per interface which are used in X-ray detectors of computed tomography and X-ray systems. Expires on 31 December May be used after that date in spare parts for CT and X-ray systems placed on the market before 1 January 2020. PB094 다음 특성 중 최소 하나 이상이 존재하는장비에서 사용하는 마이크로채널플레이트(MCP)의 납(a) 감지기 공간이 최소 3mm/MC (감지기두께 + MCP 설치 공간), 합계하여최대 6 mm로 제한되고 감지기 설치공간을 확장하는 대체 설계가 기술과학적으로 거의 실현 불가능한 경우소형 크기의 전자 또는 이온용 감지기(b) 다음 중 최소 한 가지 이상을 적용하는경우 전자 또는 이온을 감지하기 위한2차원 공간 해상도(i) 25ns 미만의 응답 시간(ii ) 149 mm2 이상의 샘플 감지 영역(ii i) 1.3 × 103 보다 큰 증배계수(c) 전자 또는 이온 감지의 경우 5ns 미만의응답 시간(d) 전자 또는 이온 감지의 경우 314 mm2이상의 샘플 감지 영역(e) 4.0 × 107 보다 큰 증배 계수 Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:(a) a compact size of the detector for electrons or ions, where the space for the detector is limited to a maximum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;(c) a response time shorter than 5 ns for detecting electrons or ions;(d) a sample detection area larger than 314 mm 2 for detecting electrons or ions;(e) a multiplication factor larger than 4,0 × PB095

Exception Code Exception_KR Exception_EN PB PB096 다음 특성 중 최소 하나 이상이 존재하는장비에서 사용하는 마이크로채널플레이트(MCP)의 납(a) 감지기 공간이 최소 3mm/MC (감지기두께 + MCP 설치 공간), 합계하여최대 6 mm로 제한되고 감지기 설치공간을 확장하는 대체 설계가 기술과학적으로 거의 실현 불가능한 경우소형 크기의 전자 또는 이온용 감지기(b) 다음 중 최소 한 가지 이상을 적용하는경우 전자 또는 이온을 감지하기 위한2차원 공간 해상도(i) 25ns 미만의 응답 시간(ii ) 149 mm2 이상의 샘플 감지 영역(ii i) 1.3 × 103 보다 큰 증배계수(c) 전자 또는 이온 감지의 경우 5ns 미만의응답 시간(d) 전자 또는 이온 감지의 경우 314 mm2이상의 샘플 감지 영역(e) 4.0 × 107 보다 큰 증배 계수 Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:(a) a compact size of the detector for electrons or ions, where the space for the detector is limited to a maximum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;(c) a response time shorter than 5 ns for detecting electrons or ions;(d) a sample detection area larger than 314 mm 2 for detecting electrons or ions;(e) a multiplication factor larger than 4,0 × PB097 산업용 모니터링 및 제어 계측기의 경우125 VAC 또는 250 VDC 미만의 정격전압용 콘덴서의 유전체 세라믹에 함유된 납 Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC for industrial monitoring and control instruments. Expires on 31 December May be used after that date in spare parts for industrial monitoring and control instruments placed on the market before 1 January 2021.

Ⅲ. Exemptions List ■ Exemptions List – Class 2
Substance Category Exception Code Exception_KR Exception_EN PFOS PF001 사진평판 공정용 포토레지스트 혹은 반사방지 코팅 Photoresists or anti reflective coatings for photolithography processs PF002 필름/종이/인쇄 평판용 사진코팅 Photographic coatings applied to films PF003 비장식성 6가 크롬 도금 mist 방지제 Mist suppressants for non-decorative hard chromium (VI) ■ Exemptions List – Class 3 Substance Category Exception Code Exception_KR Exception_EN ANTTR AT001 세라믹 부품의 첨가제 Added in ceramics for certain electronic components AT002 폴리머 재질 제조에 사용되는 촉매제 Used as a catalyst in polymeric materials for certain electronic components AT003 기포방지 및 이물제거를 위한 광학 유리 내 첨가제 Additives in Opticla glass for preventing air bubbles and removing impurities. AT004 Resistor Chip 내부 Resistive layer에 특성 구현을 위해 사용 Resistive layer inside Resistor Chip for technical reason AT005 PC 제품 CPU Substrate에 LSC(Land Side Capacitor) 장착시 사용되는 SnSb paste SnSb paste used for installation of LSC(Land Side Capacitor) on CPU Substrate of PC AT006 열전자소자 부품에 사용되는 n형 반도체(Bi2(Te, Se)3)와 p형 반도체((Bi, Sb)2 Te3) 열전도 사용된 첨가제 Additives for thermal conduction on N type semiconductor(Bi2(Te, Se3) and P type semiconductor((Bi, Sb)2 Te3) Used in Thermal Electronic devices BERYL BE001 특정 성능 발휘를 위해 커넥터 등에 사용되는 베릴륨 합금 Beryllium alloy used in connectors and certain electronic components PVC PVC01 혈액 등 체액 및 체내 가스 분석용 체외진단용의료기기에 이용되는 전류, 전위차, 전도성 전기화학 센서의 기본 물질로 사용되는 PVC내 열적안정 장치로서의 납 Lead as a thermal stabiliser in polyvinyl chloride (PVC) used as base material in amperometric, potentiometric and conductometric electrochemical sensors which are used in in-vitro diagnostic medical devices for the analysis of blood and other body fluids and body gases. Expires on 31 December 2018.

Manual for SMIS Samsung electronics Material Information Sheet Ver.1.1.

Similar presentations

Presentation on theme: "Manual for SMIS Samsung electronics Material Information Sheet Ver.1.1."— Presentation transcript:

Similar presentations

About project

지원

로그인

Auth with social network:

Manual for SMIS Samsung electronics Material Information Sheet Ver.1.1.

Similar presentations

Presentation on theme: "Manual for SMIS Samsung electronics Material Information Sheet Ver.1.1."— Presentation transcript:

Similar presentations

About project

지원