You must fill unused area with 0xFF FPO ORDER SHEET v1.3 Factory Programming Order & VERIFICATION SHEET MC80F0704 - MHF Please fill in the bold areas. 1. Customer Information 2. Device Information Company Name Package □28SKDIP(GP)□28SOP(DP) □28QFN(UP) □ Wafer Chip sales code:( ) Application Order Date YYYY MM DD Tel : Fax : Name & : Signature ROM Size 4 K byte 3. OTP file Information Check Sum File Name .OTP Chip sales code C : P검 진행한 wafer 상태로 출하하는 방식 C(C) : P검 진행한 wafer 를 sawing 하여 pass die 만 chip carrier 에 담아서 출하하는 방식 C(F) : P검 진행한 wafer 를 sawing 하여 모든 pass/fail die 를 그대로 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(G) : P검 진행한 wafer 를 sawing 하여 pass die 만 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(T) : P검 진행한 wafer 를 sawing 하여 pass die 만 Tape&Reel 로 출하하는 방식 You must fill unused area with 0xFF (code area : F000H ~ FFFFH) 4. Writing Option □ OFP enabled □ POR enabled □ ONP disabled □ R35 enabled ○ Internal 4MHz OSC. and R33/R34 Enable ○ Internal 2MHz OSC. and R33/R34 Enable ○ External R/RC OSC. and R34 Enable ○ Crystal or Renonator OSC. ○ Internal 4MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ Internal 2MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ External R/RC OSC. and XOUT=Sys.Clk/4 OSC. Configuration 5. ROM CODE Verification 6. Remark Verification Date : Marking : standard Check Sum : Option: Name:

You must fill unused area with 0xFF FPO ORDER SHEET v1.3 Factory Programming Order & VERIFICATION SHEET MC80F0708 - MHF Please fill in the bold areas. 1. Customer Information 2. Device Information Company Name Package □28SKDIP(GP)□28SOP(DP) □28QFN(UP) □ Wafer Chip sales code:( ) Application Order Date YYYY MM DD Tel : Fax : Name & : Signature ROM Size 8 K byte 3. OTP file Information Check Sum File Name .OTP Chip sales code C : P검 진행한 wafer 상태로 출하하는 방식 C(C) : P검 진행한 wafer 를 sawing 하여 pass die 만 chip carrier 에 담아서 출하하는 방식 C(F) : P검 진행한 wafer 를 sawing 하여 모든 pass/fail die 를 그대로 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(G) : P검 진행한 wafer 를 sawing 하여 pass die 만 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(T) : P검 진행한 wafer 를 sawing 하여 pass die 만 Tape&Reel 로 출하하는 방식 You must fill unused area with 0xFF (code area : E000H ~ FFFFH) 4. Writing Option □ OFP enabled □ POR enabled □ ONP disabled □ R35 enabled ○ Internal 4MHz OSC. and R33/R34 Enable ○ Internal 2MHz OSC. and R33/R34 Enable ○ External R/RC OSC. and R34 Enable ○ Crystal or Renonator OSC. ○ Internal 4MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ Internal 2MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ External R/RC OSC. and XOUT=Sys.Clk/4 OSC. Configuration 5. ROM CODE Verification 6. Remark Verification Date : Marking : standard Check Sum : Option: Name:

You must fill unused area with 0xFF FPO ORDER SHEET v1.3 Factory Programming Order & VERIFICATION SHEET MC80F0804 - MHF Please fill in the bold areas. 1. Customer Information 2. Device Information Company Name Package □32SDIP(KP)□32SOP(DP) □ Wafer Chip sales code:( ) Application Order Date YYYY MM DD Tel : Fax : Name & : Signature ROM Size 4 K byte 3. OTP file Information Check Sum File Name .OTP Chip sales code C : P검 진행한 wafer 상태로 출하하는 방식 C(C) : P검 진행한 wafer 를 sawing 하여 pass die 만 chip carrier 에 담아서 출하하는 방식 C(F) : P검 진행한 wafer 를 sawing 하여 모든 pass/fail die 를 그대로 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(G) : P검 진행한 wafer 를 sawing 하여 pass die 만 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(T) : P검 진행한 wafer 를 sawing 하여 pass die 만 Tape&Reel 로 출하하는 방식 You must fill unused area with 0xFF (code area : F000H ~ FFFFH) 4. Writing Option □ OFP enabled □ POR enabled □ ONP disabled □ R35 enabled ○ Internal 4MHz OSC. and R33/R34 Enable ○ Internal 2MHz OSC. and R33/R34 Enable ○ External R/RC OSC. and R34 Enable ○ Crystal or Renonator OSC. ○ Internal 4MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ Internal 2MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ External R/RC OSC. and XOUT=Sys.Clk/4 OSC. Configuration 5. ROM CODE Verification 6. Remark Verification Date : Marking : standard Check Sum : Option: Name:

You must fill unused area with 0xFF FPO ORDER SHEET v1.3 Factory Programming Order & VERIFICATION SHEET MC80F0808 - MHF Please fill in the bold areas. 1. Customer Information 2. Device Information Company Name Package □32SDIP(KP)□32SOP(DP) □ Wafer Chip sales code:( ) Application Order Date YYYY MM DD Tel : Fax : Name & : Signature ROM Size 8 K byte 3. OTP file Information Check Sum File Name .OTP Chip sales code C : P검 진행한 wafer 상태로 출하하는 방식 C(C) : P검 진행한 wafer 를 sawing 하여 pass die 만 chip carrier 에 담아서 출하하는 방식 C(F) : P검 진행한 wafer 를 sawing 하여 모든 pass/fail die 를 그대로 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(G) : P검 진행한 wafer 를 sawing 하여 pass die 만 wafer ring based UV tape carrier 에 옮겨서 출하하는 방식 C(T) : P검 진행한 wafer 를 sawing 하여 pass die 만 Tape&Reel 로 출하하는 방식 You must fill unused area with 0xFF (code area : E000H ~ FFFFH) 4. Writing Option □ OFP enabled □ POR enabled □ ONP disabled □ R35 enabled ○ Internal 4MHz OSC. and R33/R34 Enable ○ Internal 2MHz OSC. and R33/R34 Enable ○ External R/RC OSC. and R34 Enable ○ Crystal or Renonator OSC. ○ Internal 4MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ Internal 2MHz OSC. R33 enable and XOUT=Sys. Clk/4 ○ External R/RC OSC. and XOUT=Sys.Clk/4 OSC. Configuration 5. ROM CODE Verification 6. Remark Verification Date : Marking : standard Check Sum : Option: Name: